Buckeye Reporter

The United States Department of Defense has announced the selection of the Midwest Microelectronics Consortium (MMEC) as a regional hub under the Microelectronics Commons (ME Commons) program. This initiative, led by Ohio, is dedicated to advancing microelectronics research and production for the defense industry. The MMEC will receive $24.3 million for fiscal year 2023 as part of this designation.

The MMEC comprises over 65 public, private, and nonprofit entities with leadership from key Ohio institutions. It aims to connect academic institutions, corporate leaders, and government partners in the Midwest to enhance microelectronics capabilities. Supported by $2 billion in federal CHIPS Science Act funding, Ohio's role within the MMEC positions it at the center of a national network focused on revolutionizing the "lab-to-fab" microelectronics ecosystem while addressing national security challenges.

Governor Mike DeWine expressed enthusiasm about this development: "Being chosen as a critical hub in the ME Commons initiative places the Midwest, with leadership from key Ohio institutions, at the heart of American-made semiconductor innovation." He highlighted that partnerships with business, academic, and community leaders were instrumental in bringing this hub to fruition.

Pat Tiberi, President and CEO of the Ohio Business Roundtable, also commented on this achievement: “This ME Commons grant is a monumental win for Ohio because it opens the door to increased job creation, the development of stronger educational pipelines to support the semiconductor supply chain, and the potential of new projects within the Department of Defense."

Currently, while leading in microelectronics design globally, only 12% of U.S. production occurs domestically. This reliance on foreign economies poses risks such as loss of intellectual property and market influence. The ME Commons program seeks to address these issues by fostering partnerships among technology sources and manufacturing facilities and expanding domestic fabrication capabilities.